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| K4D623238B-QC 64M DDR SDRAM 64Mbit DDR SDRAM 512K x 32Bit x 4 Banks Double Data Rate Synchronous RAM with Bi-directional Data Strobe and DLL (100-Pin TQFP) Revision 1.2 September 2001 Samsung Electronics reserves the right to change products or specification without notice. -1- Rev. 1.2 (Sep. 2001) K4D623238B-QC Revision History Revision 1.2 (September 1, 2001) * Added K4D623238B-QL* as a low power part (ICC6=1mA) * Added ICC7 (Operating current at 4bank interleaving) * Added 100MHz@CL2 64M DDR SDRAM Revision 1.1 (August 2, 2001) * Changed tCK(max) from 7ns to 10ns Revision 1.0(June 22, 2001) Revision 0.4(April 10, 2001) - Preliminary Spec *Added K4D623238B-QC60 Revision 0.3 (February 10, 2001) - Preliminary Spec Revision 0.2 (December 13, 2000) - Target Spec *Defined Target Specification Revision 0.0 (November 21, 2000) -2- Rev. 1.2 (Sep. 2001) K4D623238B-QC 512K x 32Bit x 4 Banks Double Data Rate Synchronous RAM with Bi-directional Data Strobe and DLL FEATURES * 2.5V + 5% power supply for device operation * 2.5V + 5% power supply for I/O interface * SSTL_2 compatible inputs/outputs * 4 banks operation * MRS cycle with address key programs -. Read latency 3,4 (clock) -. Burst length (2, 4, 8 and Full page) -. Burst type (sequential & interleave) * Full page burst length for sequential burst type only * Start address of the full page burst should be even * All inputs except data & DM are sampled at the positive going edge of the system clock * Differential clock input * No Write Interrupted by Read Function 64M DDR SDRAM * Data I/O transactions on both edges of Data strobe * DLL aligns DQ and DQS transitions with Clock transition * Edge aligned data & data strobe output * Center aligned data & data strobe input * DM for write masking only * Auto & Self refresh * 16ms refresh period (2K cycle) * 100-Pin TQFP package * Maximum clock frequency up to 222MHz * Maximum data rate up to 444Mbps/pin ORDERING INFORMATION Part NO. K4D623238B-QC/L45 K4D623238B-QC/L50 K4D623238B-QC/L55 K4D623238B-QC/L60 Max Freq. 222MHz 200MHz 183MHz 166MHz Max Data Rate 444Mbps/pin 400Mbps/pin 366Mbps/pin 333Mbps/pin SSTL_2 100 TQFP Interface Package GENERAL DESCRIPTION FOR 512K x 32Bit x 4 Bank DDR SDRAM The K4D623238 is 67,108,864 bits of hyper synchronous data rate Dynamic RAM organized as 2 x1,048,976 words by 32 bits, fabricated with SAMSUNG' high performance CMOS technology. Synchronous features with Data Strobe allow s extremely high performance up to 1.8GB/s/chip. I/O transactions are possible on both edges of the clock cycle. Range of operating frequencies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications. -3- Rev. 1.2 (Sep. 2001) K4D623238B-QC PIN CONFIGURATION (Top View) 64M DDR SDRAM 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 DQ29 VSSQ DQ30 DQ31 VSS VDDQ N.C N.C N.C N.C N.C VSSQ RFU DQS VDDQ VDD DQ0 DQ1 VSSQ DQ2 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 1 2 3 4 5 6 7 8 9 51 50 49 48 47 46 45 44 43 A8(AP) VDDQ VDDQ VDDQ VDDQ VSSQ VSSQ VSSQ VREF DQ28 DQ27 DQ26 DQ25 DQ24 DQ15 DQ14 DQ13 DQ12 DQ11 DQ10 VDD DM3 DM1 DQ9 DQ8 CKE VSS CK CK MCL A7 A6 A5 A4 VSS A9 N.C N.C N.C N.C N.C N.C N.C RFU A10 VDD A3 A2 A1 A0 100 Pin TQFP 20 x 14 mm2 0.65mm pin Pitch 42 41 40 39 38 37 36 35 34 33 32 31 DQ3 DQ4 DQ5 DQ6 DQ7 DQ16 DQ17 DQ18 DQ19 DQ20 DQ21 DQ22 DQ23 DM0 DM2 BA0 VSS CAS RAS VDDQ VSSQ VDDQ VSSQ VDDQ VSSQ PIN DESCRIPTION CK,CK CKE CS RAS CAS WE DQS DM RFU Differential Clock Input Clock Enable Chip Select Row Address Strobe Column Address Strobe Write Enable Data Strobe Data Mask Reserved for Future Use BA0, BA1 A0 ~A10 DQ0 ~ DQ31 VDD VSS VDDQ VSSQ NC MCL Bank Select Address Address Input Data Input/Output Power Ground Power for DQ's Ground for DQ's No Connection Must Connect Low VDDQ VDD -4- Rev. 1.2 (Sep. 2001) BA1 WE CS K4D623238B-QC INPUT/OUTPUT FUNCTIONAL DESCRIPTION Symbol CK, CK*1 Input Type Function 64M DDR SDRAM The differential system clock Input. All of the inputs are sampled on the rising edge of the clock except DQ's and DM's that are sampled on both edges of the DQS. Activates the CK signal when high and deactivates the CK signal when low. By deactivating the clock, CKE low indicates the Power down mode or Self refresh mode. CS enables the command decoder when low and disabled the command decoder when high. When the command decoder is disabled, new commands are ignored but previous operations continue. Latches row addresses on the positive going edge of the CK with RAS low. Enables row access & precharge. Latches column addresses on the positive going edge of the CK with CAS low. Enables column access. Enables write operation and row precharge. Latches data in starting from CAS, WE active. Data input and output are synchronized with both edge of DQS. Data In mask. Data In is masked by DM Latency=0 when DM is high in burst write. DM0 for DQ0 ~ DQ7, DM1 for DQ8 ~ DQ15, DM2 for DQ16 ~ DQ23, DM3 for DQ24 ~ DQ31. Data inputs/Outputs are multiplexed on the same pins. Selects which bank is to be active. Row/Column addresses are multiplexed on the same pins. Row addresses : RA0 ~ RA10, Column addresses : CA0 ~ CA7. Column address CA8 is used for auto precharge. Power and ground for the input buffers and core logic. Isolated power supply and ground for the output buffers to provide improved noise immunity. Reference voltage for inputs, used for SSTL interface. This pin is recommended to be left "No connection" on the device Must connect low CKE Input CS Input RAS CAS WE DQS DM0 ~ DM3 DQ0 ~ DQ31 BA0, BA1 A0 ~ A10 VDD/VSS VDDQ/VSSQ VREF NC/RFU MCL Input Input Input Input/Output Input Input/Output Input Input Power Supply Power Supply Power Supply No connection/ Reserved for future use Must Connect Low *1 : The timing reference point for the differential clocking is the cross point of CK and CK. For any applications using the single ended clocking, apply VREF to CK pin. -5- Rev. 1.2 (Sep. 2001) K4D623238B-QC BLOCK DIAGRAM (512Kbit x 32I/O x 4 Bank) 64M DDR SDRAM 32 Intput Buffer I/O Control LWE LDMi CK, CK Bank Select Data Input Register Serial to parallel 64 512Kx32 Output Buffer 2-bit prefetch Sense AMP Refresh Counter Row Buffer Row Decoder 512Kx32 512Kx32 512Kx32 64 32 x32 DQi Address Register CK,CK ADDR Column Decoder LRAS LCBR Col. Buffer Latency & Burst Length Strobe Gen. Data Strobe Programming Register LCKE LRAS LCBR LWE LCAS LWCBR DLL CK,CK LDMi Timing Register CK,CK CKE CS RAS CAS WE DMi -6- Rev. 1.2 (Sep. 2001) K4D623238B-QC FUNCTIONAL DESCRIPTION * Power-Up Sequence 64M DDR SDRAM DDR SDRAMs must be powered up and initialized in a predefined manner to prevent undefined operations. 1. Apply power and keep CKE at low state (All other inputs may be undefined) - Apply VDD before VDDQ . - Apply VDDQ before VREF & VTT 2. Start clock and maintain stable condition for minimum 200us. 3. The minimum of 200us after stable power and clock(CK, CK ), apply NOP and take CKE to be high . 4. Issue precharge command for all banks of the device. 5. Issue a EMRS command to enable DLL *1 6. Issue a MRS command to reset DLL. The additional 200 clock cycles are required to lock the DLL. *1,2 7. Issue precharge command for all banks of the device. 8. Issue at least 2 or more auto-refresh commands. 9. Issue a mode register set command with A8 to low to initialize the mode register. *1 The additional 200cycles of clock input is required to lock the DLL after enabling DLL. *2 Sequence of 6&7 is regardless of the order. Power up & Initialization Sequence 0 CK, CK tRP 2 Clock min. 2 Clock min. precharge ALL Banks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 ~ ~~ ~ Command precharge ALL Banks EMRS MRS DLL Reset 1st Auto Refresh 2nd Auto Refresh ~~ ~ tRP tRFC tRFC ~ ~ 2 Clock min. Mode Register Set Any Command ~ Inputs must be stable for 200us ~ 200 Clock min. -7- Rev. 1.2 (Sep. 2001) K4D623238B-QC MODE REGISTER SET(MRS) 64M DDR SDRAM The mode register stores the data for controlling the various operating modes of DDR SDRAM. It programs CAS latency, addressing mode, burst length, test mode, DLL reset and various vendor specific options to make DDR SDRAM useful for variety of different applications. The default value of the mode register is not defined, therefore the mode register must be written after EMRS setting for proper operation. The mode register is written by asserting low on CS, RAS, CAS and WE(The DDR SDRAM should be in active mode with CKE already high prior to writing into the mode register). The state of address pins A0 ~ A10 and BA0, BA1 in the same cycle as CS, RAS, CAS and WE going low is written in the mode register. Minimum two clock cycles are requested to complete the write operation in the mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. The mode register is divided into various fields depending on functionality. The burst length uses A0 ~ A2, addressing mode uses A3, CAS latency(read latency from column address) uses A4 ~ A6. A7 is used for test mode. A8 is used for DLL reset. A7,A8, BA0 and BA1 must be set to low for normal MRS operation. Refer to the table for specific codes for various burst length, addressing modes and CAS latencies. BA1 BA0 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus RFU 0 RFU DLL TM CAS Latency BT Burst Length Mode Register DLL A8 0 1 DLL Reset No Yes Test Mode A7 0 1 mode Normal Test Burst Type A3 0 1 Type Sequential Interleave Burst Length CAS Latency BA0 0 1 An ~ A0 MRS EMRS A6 0 0 0 0 * RFU(Reserved for future use) should stay "0" during MRS cycle. 1 1 1 1 MRS Cycle 0 CK, CK Command NOP Precharge All Banks NOP NOP MRS A2 Latency Reserved Reserved Reserved 3 4 5 Reserved Reserved 0 0 0 0 1 1 1 1 A1 0 0 1 1 0 0 1 1 A0 0 1 0 1 0 1 0 1 Burst Type Sequential Reserve 2 4 8 Reserve Reserve Reserve Full page Interleave Reserve 2 4 8 Reserve Reserve Reserve Reserve A5 0 0 1 1 0 0 1 1 A4 0 1 0 1 0 1 0 1 1 2 3 4 5 6 7 8 NOP Any Command NOP NOP tRP tMRD=2 tCK *1 : MRS can be issued only at all banks precharge state. *2 : Minimum tRP is required to issue MRS command. -8- Rev. 1.2 (Sep. 2001) K4D623238B-QC EXTENDED MODE REGISTER SET(EMRS) 64M DDR SDRAM The extended mode register stores the data for enabling or disabling DLL and selecting output driver strength. The default value of the extended mode register is not defined, therefore the extened mode register must be written after power up for enabling or disabling DLL. The extended mode register is written by asserting low on CS, RAS, CAS, WE and high on BA0(The DDR SDRAM should be in all bank precharge with CKE already high prior to writing into the extended mode register). The state of address pins A0, A2 ~ A5, A7 ~ A10 and BA1 in the same cycle as CS, RAS, CAS and WE going low are written in the extended mode register. A1 and A6 are used for setting driver strength to normal, weak or matched impedance. Two clock cycles are required to complete the write operation in the extended mode register. The mode register contents can be changed using the same command and clock cycle requirements during operation as long as all banks are in the idle state. A0 is used for DLL enable or disable. "High" on BA0 is used for EMRS. All the other address pins except A0,A1,A6 and BA0 must be set to low for proper EMRS operation. Refer to the table for specific codes. BA1 BA0 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 Address Bus Extended Mode Register RFU 1 RFU D.I.C RFU D.I.C DLL BA0 0 1 An ~ A0 MRS EMRS A6 0 0 1 1 A1 0 1 0 1 Output Driver Impedence Control Normal Weak N/A Matched impedance 100% 60% Do not use 30% A0 0 1 DLL Enable Enable Disable * RFU(Reserved for future use) should stay "0" during EMRS cycle. Figure 7. Extended Mode Register set -9- Rev. 1.2 (Sep. 2001) K4D623238B-QC ABSOLUTE MAXIMUM RATINGS Parameter Voltage on any pin relative to Vss Voltage on VDD supply relative to Vss Voltage on VDD supply relative to Vss Storage temperature Power dissipation Short circuit current Symbol VIN, VOUT VDD VDDQ TSTG PD IOS Value -0.5 ~ 3.6 -1.0 ~ 3.6 -0.5 ~ 3.6 -55 ~ +150 2.0 50 64M DDR SDRAM Unit V V V C W mA Note : Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to recommended operating condition. Exposure to higher than recommended voltage for extended periods of time could affect device reliability. POWER & DC OPERATING CONDITIONS(SSTL_2 In/Out) Recommended operating conditions(Voltage referenced to VSS=0V, TA=0 to 65C) Parameter Device Supply voltage Output Supply voltage Reference voltage Termination voltage Input logic high voltage Input logic low voltage Output logic high voltage Output logic low voltage Input leakage current Output leakage current Symbol VDD VDDQ VREF Vtt VIH VIL VOH VOL IIL IOL Min 2.375 2.375 0.49*VDDQ VREF-0.04 VREF+0.15 -0.30 Vtt+0.76 -5 -5 Typ 2.50 2.50 VREF - Max 2.625 2.625 0.51*VDDQ VREF+0.04 VDDQ+0.30 VREF-0.15 Vtt-0.76 5 5 Unit V V V V V V V V uA uA Note 1 1 2 3 4 5 IOH=-15.2mA IOL=+15.2mA 6 6 Note : 1. Under all conditions VDDQ must be less than or equal to VDD. 2. VREF is expected to equal 0.50*VDDQ of the transmitting device and to track variations in the DC level of the same. Peak to peak noise on the VREF may not exceed + 2% of the DC value. Thus, from 0.50*VDDQ, VREF is allowed + 25mV for DC error and an additional + 25mV for AC noise. 3. Vtt of the transmitting device must track VREF of the receiving device. 4. VIH(max.)= VDDQ +1.5V for a pulse and it which can not be greater than 1/3 of the cycle rate. 5. VIL(mim.)= -1.5V for a pulse width and it can not be greater than 1/3 of the cycle rate. 6. For any pin under test input of 0V < VIN < VDD is acceptable. For all other pins that are not under test VIN=0V - 10 - Rev. 1.2 (Sep. 2001) K4D623238B-QC DC CHARACTERISTICS Recommended operating conditions Unless Otherwise Noted, TA=0 to 65C) 64M DDR SDRAM Version Parameter Operating Current (One Bank Active) Precharge Standby Current in Power-down mode Precharge Standby Current in Non Power-down mode Active Standby Current power-down mode Active Standby Current in in Non Power-down mode Operating Current ( Burst Mode) Refresh Current Self Refresh Current Symbol Test Condition -45 ICC1 ICC2P ICC2N ICC3P ICC3N ICC4 ICC5 ICC6 Burst Lenth=2 tRC tRC(min) IOL=0mA, tCC= tCC(min) CKE VIL(max), tCC= tCC(min) CKE VIH(min), CS VIH(min), 300 60 115 105 190 600 310 -50 280 60 110 105 180 550 300 4 1 Operating Current ( 4Bank Interleaving) ICC7 Burst Lenth=4 tRC tRC(min) -55 265 60 105 105 170 500 290 -60 250 60 100 105 160 470 280 mA mA mA mA mA mA mA mA mA 650 620 mA 2 3 4 1 Unit Note tCC= tCC(min) CKE VIL(max), tCC= tCC(min) CKE VIH(min), CS VIH(min), tCC= tCC(min) IOL=0mA ,tCC= tCC(min), Page Burst, All Banks activated. tRC tRFC(min) CKE 0.2V IOL=0mA, tCC= tCC(min) 750 700 Note : 1. Measured with outputs open. 2. Refresh period is 16ms. 3. K4D623238B-QC* 4. K4D623238B-QL* AC INPUT OPERATING CONDITIONS Recommended operating conditions(Voltage referenced to VSS=0V, VDD/ VDDQ=2.5V+ 5%, TA=0 to 65` C Parameter Input High (Logic 1) Voltage; DQ Input Low (Logic 0) Voltage; DQ Clock Input Differential Voltage ; CK and CK Clock Input Crossing Point Voltage ; CK and CK Note : Symbol VIH VIL VID VIX Min VREF+0.35 0.7 0.5*VDDQ-0.2 Typ - Max VREF-0.35 VDDQ+0.6 0.5*VDDQ+0.2 Unit V V V V Note 1 2 3 4 1. VIH(Max) = 4.2V. The overshoot voltage duration is < 3ns at VDD 2. VIL(Min) = -1.5V. The undershoot voltage duration is < 3ns at VSS 3. VID is the magnitude of the difference between the input level on CK and the input level on CK 4. The value of VIX is expected to equal 0.5*VDDQ of the transmitting device and must track variations in the DC level of the same - 11 - Rev. 1.2 (Sep. 2001) K4D623238B-QC AC OPERATING TEST CONDITIONS Parameter Input reference voltage for CK(for single ended) CK and CK signal maximum peak swing CK signal minimum slew rate Input Levels(VIH/VIL) Input timing measurement reference level Output timing measurement reference level Output load condition (VDD=2.5V0.125V, TA= 0 to 65 C) Value 0.50*VDDQ 1.5 1.0 VREF+0.35/VREF-0.35 VREF Vtt See Fig.1 Vtt=0.5*VDDQ 64M DDR SDRAM Unit V V V/ns V V V Note RT=50W Output Z0=50W VREF =0.5*VDDQ CLOAD=30pF (Fig. 1) Output Load Circuit CAPACITANCE (VDD=3.3V, TA= 25C, f=1MHz) Symbol CIN1 CIN2 CIN3 COUT CIN4 Parameter Input capacitance( CK, CK ) Input capacitance(A0~A10, BA0~BA1) Input capacitance ( CKE, CS, RAS,CAS, WE ) Data & DQS input/output capacitance(DQ0~DQ31) Input capacitance(DM0 ~ DM3) Min 1.0 1.0 1.0 1.0 1.0 Max 5.0 4.0 4.0 6.0 6.0 Unit pF pF pF pF pF DECOUPLING CAPACITANCE GUIDE LINE Recommended decoupling capacitance added to power line at board. Parameter Decoupling Capacitance between VDD and VSS Decoupling Capacitance between VDDQ and VSSQ Symbol CDC1 CDC2 Value 0.1 + 0.01 0.1 + 0.01 Unit uF uF Note : 1. VDD and VDDQ pins are separated each other. All VDD pins are connected in chip. All VDDQ pins are connected in chip. 2. VSS and VSSQ pins are separated each other All VSS pins are connected in chip. All VSSQ pins are connected in chip. - 12 - Rev. 1.2 (Sep. 2001) K4D623238B-QC AC CHARACTERISTICS Parameter CK cycle time CK high level width CK low level width DQS out access time from CK Output access time from CK Data strobe edge to Dout edge Read preamble Read postamble CK to valid DQS-in DQS-In setup time DQS-in hold time DQS write postamble DQS-In high level width DQS-In low level width Address and Control input setup Address and Control input hold DQ and DM setup time to DQS DQ and DM hold time to DQS Clock half period Data output hold time from DQS CL=2 CL=3 CL=4 64M DDR SDRAM Symbol -45 Min 10 5.0 4.5 0.45 0.45 -0.7 -0.7 0.9 0.4 0.8 0 0.3 0.4 0.4 0.4 1.0 1.0 0.45 0.45 tCLmin or tCHmin -50 Max 10 0.55 0.55 +0.7 +0.7 +0.45 1.1 0.6 1.2 0.6 0.6 0.6 - -55 Max 10 0.55 0.55 +0.7 +0.7 +0.45 1.1 0.6 1.2 0.6 0.6 0.6 - -60 Max 10 0.55 0.55 +0.75 +0.75 +0.5 1.1 0.6 1.25 0.6 0.6 0.6 - Min 10 5.0 0.45 0.45 -0.7 -0.7 0.9 0.4 0.8 0 0.3 0.4 0.4 0.4 1.0 1.0 0.45 0.45 tCLmin or tCHmin Min 10 5.5 0.45 0.45 -0.75 -0.75 0.9 0.4 0.75 0 0.25 0.4 0.4 0.4 1.1 1.1 0.5 0.5 tCLmin or tCHmin Min 10 6.0 Max 10 0.55 0.55 0.75 0.75 0.5 1.1 0.6 1.25 0.6 0.6 0.6 - Unit ns ns ns tCK tCK ns ns ns tCK tCK tCK ns tCK tCK tCK tCK ns ns ns ns ns ns Note tCK tCH tCL tDQSCK tAC tDQSQ tRPRE tRPST tDQSS tWPRES tWPREH tWPST tDQSH tDQSL tIS tIH tDS tDH tHP tQH 0.45 0.45 -0.75 -0.75 0.9 0.4 0.75 0 0.25 0.4 0.4 0.4 1.1 1.1 0.5 0.5 tCLmin or tCHmin 1 1 1 tHP-0.45 tHP-0.45 tHP-0.5 tHP-0.5 Simplified Timing @ BL=2, CL=3 tCH tCK tCL 0 CK, CK 1 2 3 4 5 6 7 8 CS tDQSCK tIS tIH tDQSS tDQSH tWPST DQS tRPRE tRPST tWPREH tWPRES tDS tDH Hi-Z tDQSQ tAC DQ Da1 Da2 Db0 Db1 Hi-Z DM WRITEB COMMAND READA - 13 - Rev. 1.2 (Sep. 2001) K4D623238B-QC 64M DDR SDRAM Note 1 : - The JEDEC DDR specification currently defines the output data valid window(tDV) as the time period when the data strobe and all data associated with that data strobe are coincidentally valid. - The previously used definition of tDV(=0.35tCK) artificially penalizes system timing budgets by assuming the worst case output vaild window even then the clock duty cycle applied to the device is better than 45/55% - A new AC timing term, tQH which stands for data output hold time from DQS is difined to account for clock duty cycle variation and replaces tDV - tQHmin = tHP-X where . tHP=Minimum half clock period for any given cycle and is defined by clock high or clock low time(tCH,tCL) . X=A frequency dependent timing allowance account for tDQSQmax tQH Timing (CL3, BL2) tHP 0 CK, CK 1 2 3 4 5 CS DQS tDQSQ(max) tQH tDQSQ(max) DQ Da0 Da1 COMMAND READA - 14 - Rev. 1.2 (Sep. 2001) K4D623238B-QC AC CHARACTERISTICS (I) Parameter Row cycle time Refresh row cycle time Row active time RAS to CAS delay for Read RAS to CAS delay for Write Row precharge time Row active to Row active Last data in to Row precharge Last data in to Read command Col. address to Col. address Mode register set cycle time Auto precharge write recovery + Precharge Exit self refresh to read command Power down exit time Refresh interval time 64M DDR SDRAM -45 Min 13 15 9 4 2 4 2 2 2 1 2 6 200 1tCK+tIS 7.8 Symbol tRC tRFC tRAS tRCDRD tRCDWR tRP tRRD tWR tCDLR tCCD tMRD tDAL tXSR tPDEX tREF -50 Max 100K -55 Max 100K -60 Max 100K Min 12 14 8 4 2 4 2 2 2 1 2 6 200 1tCK+tIS 7.8 Min 12 14 8 4 2 4 2 2 2 1 2 6 200 1tCK+tIS 7.8 Min 10 12 7 3 2 3 2 2 2 1 2 5 200 1tCK+tIS 7.8 Max 100K Unit tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK tCK ns us Note - - - - 1 1 Note : 1. For normal write operation, even numbers of Din are to be written inside DRAM AC CHARACTERISTICS (II) K4D623238B-QC45 Frequency Cas Latency 222MHz ( 4.5ns ) 4 200MHz ( 5.0ns ) 3 183MHz ( 5.5ns ) 3 166MHz ( 6.0ns ) 3 143MHz ( 7.0ns ) 3 tRC 13 12 12 10 9 tRFC 15 14 14 12 11 tRAS 9 8 8 7 6 tRCDRD tRCDWR 4 2 4 2 4 2 3 2 3 2 tRP 4 4 4 3 3 tRRD 2 2 2 2 2 tDAL 6 6 6 5 5 Unit tCK tCK tCK tCK tCK K4D623238B-QC50 Frequency Cas Latency 200MHz ( 5.0ns ) 3 183MHz ( 5.5ns ) 3 166MHz ( 6.0ns ) 3 143MHz ( 7.0ns ) 3 tRC 12 12 10 9 tRFC 14 14 12 11 tRAS 8 8 7 6 tRCDRD tRCDWR 4 2 4 2 3 2 3 2 tRP 4 4 3 3 tRRD 2 2 2 2 tDAL 6 6 5 5 Unit tCK tCK tCK tCK K4D623238B-QC55 Frequency Cas Latency 183MHz ( 5.5ns ) 3 166MHz ( 6.0ns ) 3 143MHz ( 7.0ns ) 3 tRC 12 10 9 tRFC 14 12 11 tRAS 8 7 6 tRCDRD tRCDWR 4 2 3 2 3 2 tRP 4 3 3 tRRD 2 2 2 tDAL 6 5 5 Unit tCK tCK tCK K4D623238B-QC60 Frequency Cas Latency 166MHz ( 6.0ns ) 3 143MHz ( 7.0ns ) 3 tRC 10 9 tRFC 12 11 tRAS 7 6 tRCDRD tRCDWR 3 2 3 2 tRP 3 3 tRRD 2 2 tDAL 5 5 Unit tCK tCK - 15 - Rev. 1.2 (Sep. 2001) K4D623238B-QC Simplified Timing(2) @ BL=4 0 CK, CK 64M DDR SDRAM 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 BA[1:0] BAa BAa BAa BAa BAb BAa BAb A8/AP Ra Ra Ra Rb ADDR (A0~A7, A9,A10) Ra Ca Ra Rb Ca Cb WE DQS DQ Da0 Da1 Da2 Da3 Da0 Da1 Da2 Da3 Db0 Db1 Db2 Db3 DM COMMAND ACTIVEA WRITEA PRECH ACTIVEA ACTIVEB WRITEA WRITEB tRCD tRAS tRC tRP tRRD Normal Write Burst (@ BL=4) Multi Bank Interleaving Write Burst (@ BL=4) - 16 - Rev. 1.2 (Sep. 2001) K4D623238B-QC PACKAGE DIMENSIONS (TQFP) 64M DDR SDRAM Dimensions in Millimeters 0 ~ 7x 17.20 0.20 14.00 0.10 #100 #1 23.20 0.20 20.00 0.10 0.575 0.825 0.30 0.08 0.13 MAX 0.65 0.09~0.20 1.00 0.10 1.20 MAX * 0.10 MAX 0.05 MIN 0.80 0.20 - 17 - Rev. 1.2 (Sep. 2001) |
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